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Introduction

Over the past five decades, integrated circuits have worked their way into our computers, televisions, phones, automobiles, cameras, air conditioners, appliances and toys. All this happened by making the transistor smaller and realizing the integrated circuits on planar and rigid wafers. Where else they could go if they weren’t small and rigid. There would be a dazzling array of items that technologists have long dreamed of, if integrated circuits were realized on flexible substrates. Lightweight electronic skin or sheets of sensors and circuits covering the body of robots, implantable electronics, portable and rollable carpets of solar cells, and flexible displays that roll up like window shades are some of the possibilities.

The summer school on materials, methods and technologies for flexible electronics will deal with the latest developments in the area of flexible and bendable electronics. In particular, various materials (e.g. orgnanic/inorganic), methods (e.g. flexible PCBs), and technological approaches (e.g. printing) for flexible electronics will be discussed during this workshop. The summer school offers an outstanding international representation of developers of flexible electronics technologies and users of the exciting new solutions. Graduate students and post-doc researchers interested in the areas of flexible/bendable electronics are strongly encouraged to attend this summer school.

Important Dates:

Registration Deadline – 4 September 2013*.

Hotel Reservation Deadline – 20 August 2013*.

Summer School – 11-13 September 2013

*Early registration is strongly recommended due to limited seats.

This summer school is a supported by of the EC funded Initial Training Network CONTEST (Collaborative Network for Training in Electronic Skin Technologies). The project details are available at www.contest-itn.eu