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Christof Landesberger

Fraunhofer-Einrichtung für Modulare Festkörper-Technologien EMFT, Polytronische Systeme Hansastraße 27 d, 80686 München, Germany
Preparation and properties of ultra-thin and flexible silicon substrates

This lecture covers the most widely used techniques for backside thinning of semiconductor substrates: wafer grinding, wet-chemical spin-etching, CMP polishing and plasma dry etching. Test methods for the investigation of fracture strength of brittle samples will be explained.  The specific influence of various thinning techniques on the  mechanical properties of thin silicon will be discussed. An overview on state-of-the-art dicing techniques for thin wafers will be presented as well.